Rtv Silicone Two Component Thermal Conductive Adhesive Waterproof Low Viscosity Waterproof Sealing High Moisture Resistance Glue
HN-8806 Two-Component Addition-Type Silicone Potting Rubber
Product Specification
| | Test Items | Test Standard | Units | Product test results |
| Part A | Part B |
| Before curing | 1 | Appearance | --- | --- | Grey, fluid | White, fluid |
| 2 | Viscosity | GB/T10247-2008 | 25ºC, mPa·S | 4500~5000 | 4500~5000 |
| 3 | Density | GB/T 13354-92 | 25ºC, g/cm³ | 1.50±0.05 | 1.50±0.05 |
| 4 | Mixing Ratio (A : B) | 1:01 | Weight ratio | 100 | 100 |
| | Volume ratio | 100 | 100 |
| 5 | Operating time | Measured | hr | 0.3-0.4 | |
| 6 | Curing condition | Measured | hr | 4^12 (25ºC,initial cure) |
| 0.20 (80ºC) |
After
Curing | 7 | Appearance | --- | --- | Grey elastomer |
| 8 | Hardness | GB/T 531.1-2008 | Shore A | 50±5 |
| 9 | Thermal conductivity | GB/T10297-1998 | w/m·k | ≥0.76 |
| 10 | Expansivity | GB/T20673-2006 | μm/(m,ºC) | 210 |
| 11 | Moisture Absorption | GB/T 8810-2005 | 24h,25ºC, % | 0.01~0.02 |
| 12 | Volume resistivity | GB/T 1692-92 | (DC500V),Ω · cm | 1.0×10¹⁵ |
| 13 | Dielectric intensity | GB/T 1693-2007 | Kv/mm(25ºC) | 18^25 |
| 14 | Temperature Resistance | Measured | ºC | -50~+250°c |
Product Advantages
High-Performance Elastomer: Forms a high-elasticity, high-strength protective layer after curing.
Low Viscosity: Suitable for deep-section potting, ensuring even distribution.
No By-Products: No heat or by-products are emitted during curing, ensuring component safety.
Flame Retardant: Passes UL-94 flame retardancy tests, ensuring safety in high-temperature environments.
Eco-Friendly Certification: Complies with RoHS standards, non-polluting.
Applications
Potting and sealing of power modules, circuit boards, and high-voltage transformers.
Protection and thermal management for battery packs and fast-charging adapters.
Moisture-proof and waterproof protection for LED outdoor drive power supplies.
Other electronic components requiring vibration, water, and thermal protection.
Application Method
1.Mix components A and B in a 1:1 ratio, stir thoroughly, and then proceed with potting.
2.Ensure the surface of the components is clean before potting. For large products, pot in stages.
3.For automated production lines, vacuum components A and B separately to ensure accurate mixing ratio.
Technical Parameters
Appearance: Part A – Grey fluid; Part B – White fluid
Viscosity: 4500~5000 mPa·S
Density: 1.50±0.05 g/cm³
Mixing Ratio (A:B): 1:1
Pot Life: 0.3-0.4 hours
Curing Conditions: 4-12 hours at room temperature (initial cure), 0.2 hours at 80°C
Hardness: 50±5 Shore A
Thermal Conductivity: ≥0.76 W/m·K
Volume Resistivity: 1.0×10¹⁵ Ω·cm
Temperature Resistance: -50°C to +250°C
Packaging
10KG/Set (A 5kg + B 5kg)
20KG/Set (A 10kg + B 10kg)
50KG/Set (A 25kg + B 25kg)
Precautions
Stir components A and B separately before use to ensure even mixing.
Avoid contact with substances containing tin, sulfur, or amines to prevent curing inhibition.
Maintain cleanliness during use to prevent contamination.
Product Tags:
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2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel Images
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