Silicone Potting Compound Two-Component Flame Retardant Insulation Black High Quality Resin for Circuit Board Power Module
HN-8808 two-component room temperature curing potting silicone
Product Specification
| №. | Items | Technique Request |
| 1 | Exterior | Transparent / White / Grey Liquid |
| 2 | Viscosity mPa.S (before curing) | A: 2000, B: 50 |
| 3 | Specific gravity (23℃) | 0.98 |
| 4 | In commission time (h, 25℃) | 1–2h |
| 5 | Entirely sulfuration time (min, 25℃) | 8–12h |
| 6 | Hardness (JIS A) | 25A |
| 7 | Volume resistivity (Ω·cm) | ≥1×10¹⁴ |
| 8 | Strength of breakdown voltage (kV/mm) | 18–25 |
| 9 | Dielectric constant (1MHz) | 2.5–3.0 |
| 10 | Dielectric loss (1MHz) | ≤4×10⁻³ |
| 11 | Thermal conductivity (W/m·K) | 0.1–0.20 |
Product Overview
HN-8808 is a low viscosity, two-component room temperature curing silicone that forms a soft rubber material after curing. It has excellent moisture resistance and a wide temperature range (-57°C to 250°C), suitable for sealing, potting and insulation of a variety of electronic and household appliances.
Product Features
Wide temperature resistance range: -57°C to 250°C, suitable for extreme environments.
Excellent electrical performance: still maintain good electrical performance under harsh conditions.
Environmentally friendly and safe: non-toxic, odorless, non-corrosive, and non-expanding.
Strong adhesion: good adhesion to metals (aluminum, iron), acrylic and PC plastics, improving waterproof sealing performance.
Application areas
Electronic appliances: PCB potting, sensor sealing, LED packaging.
Household appliances: waterproof sealing, insulation protection.
Industrial equipment: shockproof, anti-fouling, coating protection.
Instructions
Mix in a ratio of A:B = 10:1 and pour into the mold.
Remove surface bubbles and cure at room temperature (the ratio can be adjusted according to actual needs. The larger the proportion of component B, the faster the curing).
Packing specifications
Component A: 10KG/20KG plastic barrel
Component B: 1KG plastic barrel
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